MCPCB process capability is as follows：

1. Maximum number of layers:  6

2. metal substrates with a thickness of 4.0mm.

3. Maximum size of delivery board: 1300mm x 540mm.

4. Maximum copper thickness of inner and outer layers: 2oz.

5. The maximum drilled hole of aluminum substrate can reach 6.4mm,

6. the minimum drilled hole of copper substrate can reach 6.0mm, and the minimum drilled hole of copper substrate can reach 0.60mm

7. The dielectric breakdown voltage can reach 6000 V/AC, and the thermal conductivity can reach 12W/m.K

8. Metal matrix type: Copper, aluminum,Stainless steel, iron.