PCB process capability is as follows：

1. Number of layers: 2 /4 /6 /8

2. Maximum delivery board: 699mm*594mm

3. Maximum copper thickness (inner/outer layer): 6oz

4. Maximum board thickness: 5.0mm

5. Maximum aspect ratio: 15:1

6. Surface treatment: spray pure tin, deposit gold, deposit silver, deposit tin, OSP, nickel, palladium and gold finger.